3D X-ray

3D X-ray

技术原理
X射线对多数物质具有强穿透性，可无损探察物体内部结构，广泛应用于生物医疗、材料及半导体检测（如IC导线键合、银胶填充、引线框架等结构缺陷分析）。

传统2D X-ray技术通过穿透样品产生二维投影影像，但路径上所有结构的叠加效应会导致关键区域（如封装失效点）影像模糊。

3D X-ray显微技术突破此局限：

1. 三维重构 - 旋转样品获取多角度二维断层图像，经算法重建三维结构

2. 无损检测 - 保持样品完整性，适用于MEMS/3D IC/PCB等精密器件失效分析

分析应用
▶ 跨领域检测
• 微电子/材料科学/生命科学领域三维成像
• IC封装/MEMS/3D IC/PCB内部结构可视化

▶ 封装失效诊断
• 焊点开裂/短路/空洞/裂纹/金属导体缺陷检测
• 硅（Si）、铝（Al）等微量元素成分对比分析

▶ 核心技术优势
• 超高空间分辨率：~700 nm（不受样品尺寸影响）
• 兼容8/12英寸晶圆全尺寸检测
• 提供非破坏性三维纵切方案，弥补SEM/FIB破坏性局限

Technical Principle
X-rays exhibit strong penetration through most materials, enabling non-destructive inspection of internal structures. This technology is widely deployed in biomedical, materials, and semiconductor applications (e.g., detecting anomalies in IC wire bonds, silver epoxy fills, lead frames).

Conventional 2D X-ray produces projection images where overlapping structures along the beam path cause blurring of critical regions (e.g., package failure points).

3D X-ray Microscopy overcomes these limitations:

1. 3D Reconstruction - Rotational scanning captures multi-angle 2D tomographic images, algorithmically reconstructed into 3D models

2. Non-Destructive Testing - Preserves sample integrity, ideal for failure analysis in MEMS/3D ICs/PCBs

Analytical Applications
▶ Cross-Domain Imaging
• 3D visualization in microelectronics/materials science/life sciences
• Internal structure mapping of IC packages/MEMS/3D ICs/PCBs

▶ Package Failure Diagnosis
• Detection of solder joint cracks/shorts/voids/fractures/metal conductor defects
• Elemental contrast analysis of trace elements (e.g., Si, Al)

▶ Core Advantages
• Ultra-high spatial resolution: ~700 nm (unaffected by sample size)
• Full-wafer compatibility: 8-inch/12-inch wafers
• Non-destructive sectional alternative to destructive SEM/FIB techniques