产品资料
动态热机械分析仪DMA
产品型号:DMA 303 Eplexor®
简介介绍:

动态热机械分析(DMA/DMTA)是确定工程材料机械性能,特别是聚合物的黏弹行为 的一个不可缺少的工具。 通过在动态振荡条件下对材料施加力和形变,可以测量材料的黏弹性,及其随一些参数(如温度、时间、频率、应力、气氛, 或这些参数的组合)的变化函数关系

详情介绍

动态热机械分析仪 DMA 303 Eplexor® 如何助力产品设计?
聚合物——制造业的关键材料
聚合物兼具轻量化与易成型优势,可通过多种工艺塑造复杂结构。尤其在汽车、电子、医疗等关键功能部件领域,其性能必须严格满足设计要求。这要求我们深入理解材料行为——从微观分子结构到宏观机械性能。

预测机械行为——新产品设计的核心
动态机械分析(DMA)是一种高灵敏度技术,用于评估设计与生产中的材料特性。它可精准测定刚性、弹性、阻尼及黏弹性等综合机械性能。

DMA 303 Eplexor® 的核心分析能力
∙ 黏弹性表征:储能模量、损耗模量、损耗因子
∙ 多维度性能评估

  • 温频依赖性(-170°C至800°C / 0.001 Hz至150 Hz)

  • 变应力/应变水平下的刚性与阻尼特性

  • 可控气氛或液态介质环境
    ∙ 材料相变与反应识别

  • 高交联聚合物与复合材料的玻璃化转变温度

  • 聚合物共混物相容性(组分与结构关联)

  • 填料与添加剂的影响

  • 树脂固化及后固化过程
    ∙ 老化效应分析
    ∙ 时温叠加(TTS)行为预测
    ∙ 蠕变与应力松弛研究

突破性硬件性能
▸ 50N 动态/静态力加载
台式设计实现高达50N的加载力,可表征高刚性材料机械行为。
▸ -170°C ~ 800°C 宽温域覆盖
解析材料热机械性能演变。
▸ 0.001 Hz ~ 150 Hz 宽频测试
精准捕捉材料结构与特性频响。
▸ 1nm 位移分辨率
灵敏检测微观性能变化,确保数据可靠性。
▸ ±2.5mm 宽幅振幅
支持非线性黏弹区测量,拓展分析维度。
▸ 多模式形变与智能夹具系统
依材料与样件几何灵活选择:

  • 拉伸|三点弯曲|压缩/压入|悬臂|剪切

  • RFID智能识别夹具,快速切换
    ▸ 先进软件功能

  • 快速启动:首页直接初始化测试,自动识别样件尺寸

  • 高效预检:手动模式即时加载静/动态力,快速评估材料特性

  • 模板化操作:一键调用预设或自定义测量方案


How Does the DMA 303 Eplexor® Dynamic Thermomechanical Analyzer Help Achieve Product Design Goals?
Polymers – Critical Materials in Manufacturing
Polymers offer advantages of lightweight properties and ease of molding into complex shapes through diverse processes. Especially in applications where plastic components serve critical functions—such as automotive, electronics, and medical industries—their performance must strictly comply with design requirements. This demands a profound understanding of material behavior, from microscopic molecular structures to macroscopic mechanical properties.

Predicting Mechanical Behavior – Essential for New Product Design
Dynamic Mechanical Analysis (DMA) is a highly sensitive technique for evaluating material properties during design and production. It accurately determines a comprehensive range of mechanical characteristics, including stiffness, elasticity, damping, and viscoelastic behavior.

Core Capabilities of the DMA 303 Eplexor®
∙ Viscoelastic Characterization: Storage modulus, loss modulus, loss factor
∙ Multidimensional Performance Assessment:

  • Temperature/frequency dependence (-170°C to 800°C / 0.001 Hz to 150 Hz)

  • Stiffness and damping under variable stress/strain levels

  • Controlled atmosphere or liquid immersion environments
    ∙ Material Phase Transition & Reaction Identification:

  • Glass transition temperature of highly crosslinked polymers and composites

  • Compatibility of polymer blends (correlated with composition and structure)

  • Impact of fillers and additives

  • Resin curing and post-curing processes
    ∙ Aging Effect Analysis
    ∙ Time-Temperature Superposition (TTS) Prediction
    ∙ Creep and Stress Relaxation Studies

Breakthrough Hardware Performance
▸ 50N Dynamic/Static Force Loading
Benchtop design delivers up to 50N force for characterizing rigid materials.
▸ -170°C to 800°C Extended Temperature Range
Comprehensive analysis of thermomechanical property evolution.
▸ 0.001 Hz to 150 Hz Broad Frequency Testing
Precise characterization of structural and property frequency responses.
▸ 1nm Displacement Resolution
Sensitive detection of micro-property changes for data reliability.
▸ ±2.5mm Wide Amplitude Range
Supports measurements beyond linear viscoelastic region.
▸ Multi-Mode Deformation & Smart Fixture System
Flexible configuration based on material and geometry:

  • Tension|Three-point bending|Compression/Indentation|Cantilever|Shear

  • RFID-enabled automatic fixture recognition
    ▸ Advanced Software Features

  • QuickStart: Direct test initialization from home screen with automatic sample dimension detection

  • Efficient Pre-screening: Manual mode for instant static/dynamic loading to rapidly evaluate material properties

  • Template Operation: One-click access to preset or customized measurement protocols


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