ASM AB383 全自动微焊线邦定机
核心定位：LED专用高速焊线系统

主要特点

• 高效兼容性：专为多样化SMD封装设计，支持5050、5630、3528、侧光LED、Chip LED等全系列封装

• 智能视觉系统：高精度图像识别，毫秒级定位响应

• 光学：定制LED芯片识别镜头，实现精准高速对位

• 免维护导线器：一键穿线设计，清洁效率提升80%

• COB敏捷编程：图形化操作界面，程序教读速度提升50%

• 柔性工作台：模块化治具支持≤80mm引线框架，大焊线范围56mm×70mm

• 全材料适配：支持铜线、钯铜线、银线及银合金等非金线材焊接

 ASM AB383 Automatic Micro Wire Bonder

Core Positioning: High-Speed LED-Specific Wire Bonding System

Key Features

• Extended Compatibility: Engineered for diverse SMD packages including 5050, 5630, 3528, side-view LEDs, Chip LEDs, etc.

• Intelligent Vision: High-precision image recognition system with millisecond-level response

• Optical Innovation: Dedicated lens for LED chip alignment ensuring precision at high speed

• Maintenance-Free Wire Clamp: Tool-free threading and 80% faster cleaning efficiency

• COB Rapid Programming: Intuitive GUI slashes teaching time by 50%

• Adaptive Workstage: Modular fixtures accommodate ≤80mm lead frames (max bonding area: 56mm×70mm)

• Multi-Material Support: Compatible with Cu, PdCu, Ag, and Ag alloy wires