ASM引线键合焊线机Automatic microWire bonder----AB550
产品型号：ASM AB550
简介介绍：ASM邦定机焊线机AB550为桌面式焊线机，应用于细铝线的引线键合，主要应用于COB领域
详情介绍
ASM AB550 全自动高密度焊线机
核心定位：微型器件精密焊接专家
突破性性能
技术
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系统
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技术优势
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工作台
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高刚性减震设计，振动幅度降低40%
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视觉系统
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图像识别技术，定位速度提升35%
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超声焊头
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自适应阻抗匹配，能量损耗降低15%
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核心参数
ASM AB550 Automatic Ultrasonic Wire Bonder
Positioning: Micro-Device Precision Bonding Specialist
Breakthrough Performance
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Ultra-High Speed: 9 wires/sec (32,400 UPH)
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Micro-Bonding Capability:
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Min bond size: 63×80μm
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Min bond pitch: 68μm*
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Extended Work Area: Ø100mm circular bonding zone
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Zero-Maintenance Design: Critical motion modules require no servicing
Technical Innovations
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System
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Advantage
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Workstage
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High-rigidity damping (40% less vibration)
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Vision System
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Patented image recognition (35% faster alignment)
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Ultrasonic Transducer
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Adaptive impedance matching (15% energy loss reduction)
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Key Specifications
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Bonding Accuracy: ±0.8μm (@3σ)
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Wire Compatibility: Au 15-50μm / Cu 20-75μm
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Applications: CIS sensors, medical micro-devices, RF modules
