ASM 贴片机 TX Micron
专为子模块和 SiP 设计的高速度、高精度贴装解决方案

全新 SIPLACE TX micron 模块以 15 μm @ 3σ 精度运行，依托精密硬件（如高分辨率陶瓷玻璃光栅尺）与先进算法，确保稳定良率。
其突破性的 96,000 cph 贴装速度与超高精度结合，使 TX micron 成为大批量、高精度模块、系统级封装（SiP）及微型化应用的理想选择。

核心亮点

• 贴装速度：高达 96,000 cph

• 贴装精度：

  • 标准：25/20 µm @ 3σ

  • 配备真空泵：15 μm @ 3σ

• PCB 兼容尺寸：

  配置	尺寸范围 (长×宽)
  双轨	50 mm × 45 mm 至 375 mm × 260 mm
  单轨	50 mm × 45 mm 至 375 mm × 460 mm
  真空泵选配	50 mm × 55 mm 至 250 mm × 100 mm

• 设备尺寸：1.00 m × 2.23 m × 1.45 m（紧凑型设计）

• 供料能力：支持 80× 8 mm 供料器，兼容 JEDEC 托盘

• 认证标准：SEMI S2/S8，ISO 7 级洁净室认证

• 贴装压力：低至 0.5N

• 非接触式贴装技术：针对高敏感元件，提升贴装质量

• 先进功能：

  • 视觉检测系统

  • 线性点胶单元（自动调谐）

ASM Placement Machine TX Micron
High-Speed & High-Precision Placement for Submodules and SiP

The new SIPLACE TX micron module operates at 15 μm @ 3σ accuracy. Combining precision hardware (e.g., high-resolution ceramic glass linear encoders) and advanced algorithms, it delivers consistent yield excellence.
With record-breaking speed (96,000 cph) and ultra-fine precision, the TX micron is the unrivaled choice for high-volume, high-accuracy modules, system-in-package (SiP), and miniaturization-critical applications.

Key Features

• Placement Speed: Up to 96,000 cph

• Placement Accuracy:

  • Standard: 25/20 µm @ 3σ

  • With vacuum pump: 15 μm @ 3σ

• PCB Compatibility:

  Configuration	Dimensions (L×W)
  Dual-lane	50 mm × 45 mm to 375 mm × 260 mm
  Single-lane	50 mm × 45 mm to 375 mm × 460 mm
  With vacuum pump	50 mm × 55 mm to 250 mm × 100 mm

• Footprint: 1.00 m × 2.23 m × 1.45 m (compact design)

• Feeder Capacity: Up to 80× 8 mm feeders, JEDEC tray compatible

• Certifications: SEMI S2/S8, Cleanroom ISO Class 7

• Placement Force: As low as 0.5N

• Contactless Placement: Enhanced quality for sensitive components

• Advanced Functions:

  • Vision inspection system

  • Auto-tuned linear dispensing unit