ASM 贴片机 SX2/SX1
灵活适应多元化生产需求的贴装平台

作为全球高混合电子制造的优选解决方案，SX2/SX1凭借三大升级贴装头实现灵活性：

• SIPLACE SpeedStar：高速贴装

• SIPLACE MultiStar：多功能兼容

• SIPLACE TwinStar：双料同步处理

支持广泛供料器及传输方案，即使异形元器件也能稳定贴装。通过双轨传输系统高效处理小型PCB（450 mm × 265 mm），结合AMS智能传输模块可扩展至大型板卡（1,525 mm × 560 mm）。

核心技术优势

1. 异形件功能包

   • 突破行业限制，显著减少人工干预

   • 集成流程控制提升良率与产出

2. 开放式供料器接口

   • 兼容第三方供料器，增强供应链弹性

3. 3D视觉检测系统

   • 双图像合成技术精准建模

   • 可靠识别THT引脚损伤

   • 关键区域定向检测：
     ✓ 焊盘定位
     ✓ 屏蔽框下元件漏失检查
     ✓ 位置精度验证

4. 自适应贴装控制

   • 压力范围：0.5 N–100 N

   • 非接触式贴装：兼容敏感LED至坚固连接器

   • 智能速度调节：针对异形件自动优化运行速率，消除无效减速

ASM Placement Machine SX2/SX1
Adaptable Platform for High-Mix Electronics Manufacturing

As the global benchmark for flexible production, the SX2/SX1 integrates three advanced placement heads:

• SIPLACE SpeedStar: High-speed placement

• SIPLACE MultiStar: Multi-component compatibility

• SIPLACE TwinStar: Dual-material synchronization

Supports diverse feeders and transport options, ensuring stable placement even for odd-form components. Dual-lane transport handles compact PCBs (450 mm × 265 mm), while the AMS Smart Transport Module extends capacity to large boards (1,525 mm × 560 mm).

Core Technological Advantages

1. Odd-Form Component Package

   • Redefines industry limits, minimizing manual assistance

   • Integrated process control boosts yield and output

2. Open Feeder Interface

   • Third-party feeder compatibility for supply chain flexibility

3. 3D Vision Inspection

   • Dual-image synthesis for precision modeling

   • Reliable detection of damaged THT pin headers

   • Targeted board-level checks:
     ✓ Pad positioning
     ✓ Component omission under shielding frames
     ✓ Placement accuracy verification

4. Adaptive Placement Control

   • Force range: 0.5 N–100 N

   • Contactless placement: From sensitive LEDs to robust connectors

   • Intelligent speed optimization: Auto-adjusts for odd-form components, eliminating unnecessary deceleration