ASM全自动邦定机
引线键合机又称为邦定机，焊线机
ASM全自动邦定机焊线机销售
目前主打铝线邦定机为AB550/AB589/AB589H
目前主推金线/铜线邦定机为iHAWK Aero/Eagle Aero
我们主要在半导体封装/OPTO光电/COB行业
根据客户的产品及工艺要求配置合理的设备及方案
价格实惠，交期合理
ASM铝线机，ASM金线机
全自动焊线机（旋转式焊头平台）
高速焊线速度
微间距焊线能力
焊线范围
高精度旋转式焊头设计
支援多元化夹具设计，切合不同产品需求
全自动物料处理能力
专注为电子制造商提供如下SMT设备：
锡膏印刷机、锡膏测厚仪SPI、SMT贴片机、回流焊、光学检测AOI、X-Ray X光射线检测机等整线SMT生产线设备，服务及解决方案。
专注为半导体芯片及封测提供如下半导体设备及仪器：
光刻机，刻蚀机，离子注入机，磁控溅射镀膜机，匀胶显影机，CMP，清洗机，DieBond固晶机、DieAttach晶圆贴片机粘片机、WireBond焊线机引线键合机、Molding塑封机、平行缝焊机、WaferGrinding研磨机、WaferSaw切割机、X-RayX光检测机、BondTest推拉力测试机、Plasma等离子清洗机、C-SAM超声波扫描、SEM扫描电镜，TEM透射电镜，FIB聚焦离子束，EBL电子束光刻，AFM原子力显微镜等设备
提供从IC
Design→Fabless→封装测试→SMT表面组装的整套集成电路电子制造的行业资源，设备及解决方案
We
specialize in furnishing electronic manufacturers with the following SMT
equipment:
Solder
paste printers, solder paste
inspection
systems (SPI), SMT placement machines, reflow ovens, automated optical
inspection (AOI) systems, X-ray inspection machines, and other comprehensive
SMT production line equipment, services, and solutions.
Additionally,
we specialize in providing
semiconductor
chips and packaging and testing sectors with the following semiconductor
equipment and instruments:
Lithography
machines, etching machines, ion
implantation
systems, magnetron sputtering coating systems, spin coaters, chemical
mechanical planarization (CMP) machines, cleaning machines, DieBond die
attachers, DieAttach wafer bonding/mounting machines, WireBond wire bonding
machines, molding encapsulation machines, parallel gap welding machines, wafer
grinding machines, wafer sawing machines, X-Ray X-ray inspection systems,
BondTest push-pull testers, plasma cleaning systems, C-SAM ultrasonic scanners,
scanning electron microscopes (SEM), transmission electron microscopes (TEM),
focused ion beam (FIB) systems, electron beam lithography (EBL) systems, atomic
force microscopes (AFM), and more.
We
offer a comprehensive suite of industry
resources,
equipment, and solutions spanning from IC design, fabless manufacturing,
packaging and testing, to SMT surface mount assembly..
