DEK印刷机EbyDEK
产品型号：ASM EbyDEK
简介介绍：EbyDEK锡膏印刷机
DEK印刷机品牌高性价比的锡膏印刷机，在手机，汽车电子等SMT优异产品领域广泛运用
进口品牌印刷机*具性价比的SMT锡膏印刷机
详情介绍
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高速高精度印刷
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质量保障技术
智能化软件与操作体验
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用户界面与集成
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夹持技术
应用场景扩展能力
通过模块化套件覆盖多元需求：
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应用套件类型
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专项能力
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客户价值
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LED套件
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620mm长板支持/重板轨道/远程停板器
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稳定印刷LED长板及重型基板79
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汽车电子套件
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锡膏高度监测/进阶SPC/焊膏覆盖率检测
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提升工艺稳定性，满足车规级标准4
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柔性板套件
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专用顶针/边沿夹具/可调钢网宽度
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支持柔性电路板及异形基板印刷47
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Machine performance机器性能
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Specifications
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Alignment印刷精度
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@ ±12.5 µm*
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Machine accuracy重复精度
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> 2,0 Cmk@ ±25 µm, (6 sigma)
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Shortest core cycle time (CCT)印刷周期
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11 seconds (8
seconds with option)
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Operating system操作系统
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Windows 7 Standard embedded
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Squeegee pressure刮刀压力
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Software-controlled,
motorized with ±1 kg closed-loop feedback
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Stencil positioning钢网定位
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Depth stop or
semi-automatic stencil loading (optional)
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Stencil
mount钢网尺寸
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736 mm x 736
mm (29" x 29") or flexible stencil width adjustment for sizes
ranging
from 381 mm to 736 mm with frame thickness ranging from 25 mm
to 38 mm (optional)
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Understencil cleaning清洗方式
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300/400/520 mm DEK Interchangeable Under Stencil Cleaner (DEK
IUSC), programmable for wet, dry and vacuum cleaning
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Substrate sizes基板尺寸
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50 mm (X) x
40.5 mm (Y) to 510 mm (X) x 508.5 mm (Y)
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Substrate thicknesses基板厚度
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0.2 mm to 6
mm
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Product changeover产品转换
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< 2 min
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Program creation程序创建
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< 10
minutes
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Substrate
clamping基板夹紧
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Over-the-top clamping (OTT) Lateral clamping (optional)
Substrate vacuum (optional)
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Temperature and humidity sensors温湿度感应
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Statistical
recording of temperature and humidity readings
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Paste verification视觉相机
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Hawkeye 750
(optional)
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