推拉力测试--封装键合质量监控

常见键合缺陷类型：
键合线变形、焊点偏移、焊点尺寸超标、焊点颈部裂纹（Heel Crack）、键合线损伤、表面划伤、芯片压焊块铝层剥离、弹坑（Crater）、芯片缺损等。其中，部分缺陷可通过显微镜外观检测判定，其余需借助专用设备进行破坏性分析确认。

推拉力测试——封装键合质量监控

1. 键合线拉力测试

   • 方法： 将钩针置于键合线中段，匀速垂直上提直至线断裂，记录拉力值及断裂位置。

   • 判定标准：

     • 拉力值需满足工艺要求（注：拉力随线径增大而升高）；

     • 断裂位置为关键指标：除焊点剥离（Lift-off）外，其他断裂模式均视为合格。

   • 失效分析提示：
     焊点开裂常伴随拉力值偏低及塑封料分层，需结合工艺流程系统性排查根源。

2. 焊点剪切力测试

   • 方法： 使用治具平行于芯片表面推剪焊点，直至焊点断裂，记录剪切力值及破裂形貌。

   • 理想失效模式： 键合材料残留于芯片或框架表面（即界面未分离）。

设备推荐：Dage 推拉力测试机（全球市占率 >80%）

推荐型号： DAGE 4000 PLUS 焊接强度测试仪（Bond Tester）
核心优势： 精准量化键合强度，支持拉力/剪切力双模式检测，为封装可靠性提供数据保障。

Professional English Translation

Common Wire Bonding Defects:
Wire deformation, bond offset, abnormal bond size, heel crack, wire damage, surface scratches, aluminum layer peeling on chip pads, cratering, chip chipping, etc. Some defects can be identified via microscopic visual inspection, while others require destructive analysis with specialized equipment.

Bond Pull/Shear Testing – Quality Control for Package Bonding

1. Wire Pull Test

   • Method: Place a hook at the midpoint of the wire. Pull vertically at a uniform speed until fracture occurs. Record pull force value and break location.

   • Acceptance Criteria:

     • Pull force must meet specifications (Note: Force increases with wire diameter);

     • Break location is critical: Any failure mode except bond lift-off is acceptable.

   • Failure Analysis Insight:
     Bond cracking often correlates with low pull force and delamination of molding compound. Root cause analysis should cover relevant process steps.

2. Bond Shear Test

   • Method: Use a tool to shear the bond parallel to the chip surface until fracture. Record shear force value and failure morphology.

   • Ideal Failure Mode: Bond material remains on the chip or substrate surface (i.e., interfacial cohesion maintained).

Recommended Equipment: Dage Bond Testers (>80% Global Market Share)

Flagship Model: DAGE 4000 PLUS Bond Tester
Key Advantage: Precisely quantifies bond strength with pull/shear dual-mode testing, ensuring package reliability through data-driven validation.